Not long ago, Samsung launched a new generation of 3D chip packaging technology. Recently, there are reports that Samsung is accelerating the deployment of this technology in order to compete with TSMC in high-end chip packaging next year.
Samsung’s 3D chip packaging technology is called eXtended-Cube, or X-Cube, and is currently fully applicable to the 7nm process technology. This packaging scheme uses vertical electrical connections instead of wires. It enables multi-layer ultra-thin stacking and utilizes through-silicon via (TSV) technology to fabricate logic semiconductors. With the help of 3D packaging technology, chip designers can have higher flexibility in designing customized solutions to meet the special needs of customers.
Samsung said that the technology has successfully gone through the trial production stage, and its ability to improve chip operation speed and energy efficiency has also been verified.
Samsung is currently the world’s second-largest chip maker. On top of the initial design, Samsung also plans to continue working with Fabless customers around the world to advance the use of 3D IC solutions in next-generation high-performance applications.
The Links: 2MBI300U4H-120 PM75CSE120